Abstract:
Aluminium thin films exhibit excellent coating properties suitable for optical,
microelectronics, telecommunications and constructional/structural applications. Thin
aluminium film deposition is mainly accomplished via physical or chemical methods at
varying deposition conditions, parameters and substrates. This study focuses on thin
aluminium films prepared using physical methods which have superior properties to chemical
methods and are extensively researched in the published literature. The review discusses the
properties of thin aluminium films and their complex interactions with process parameters.
The properties of thin films depend on the deposition parameters which include substrate
temperature, deposition rate, power, process pressure, substrate surface finish, and target
temperature. Post-deposition treatment of the films and the type of substrate also influence
the properties of thin films. This review therefore highlights the significance of optimising
the deposition methods and identifies research gaps in the published studies. The work can be
a primary resource for selection of essential process parameters during physical deposition
aluminium films.
